WSESST-2025

GORDON ELGER studied physics and made his PhD 1998 at the Free University of Berlin. He worked as scientific coworker at the Fraunhofer Institute for Reliability and Microintegration (Fraunhofer-IZM). Afterwards he worked in industry for more than ten years. Since 2013 he is professor at the University of Applied Science in Ingolstadt (THI) for electronic manufacturing technologies. In 2016 he became research professor heading a research group within the field of microelectronic packaging. Since 2019 he is also head of the Applied Research Center for "Connected Mobility and Infrastructure" of the Fraunhofer Institute for Transportation and Infrastructure Systems. The core area of Gordon Elger's research is optoelectronic-, power electronic- and sensor packaging for automotive applications. One focus is the development of first and second level interconnects, e.g. residual free solder processes, new materials and processes for sintering. In especially he developed with his research team copper-based sinter pasts and inks and founded the company CuNex for commercializing the new materials. Another focus of his research is reliability assessment and functional safety of the electronic components, modules and systems using physical and data driven modelling. Further research areas of Gordon Elger are industry 4.0 and application of machine learning in manufacturing of microelectronic systems, in especially Advanced Driver Assistance Systems (ADAS), sensor modelling and sensor data fusion technologies for ADAS sensor systems for environmental perception.